Especially for small-sized and flat-designed devices in building automation, METZ CONNECT has developed a spring clamp terminal block with compression-mount contact technology.
Devices are increasingly becoming smaller and flatter. Consequently the available space on the PC board is becoming more and more limited – and the connection technology requirements increase. Especially the permanently growing and more and more diversified market of building automation makes complex demands on the PC board connection technology of automation components: the focus lies on integration, migration, miniaturization and reliability. METZ CONNECT provides perfect solutions to these demands by offering innovative PC board connections.
Due to the ideal use of the available space, the new spring clamp terminal blocks with compression-mount technology from METZ CONNECT are highly suitable for compact, sandwich-type wall-mounted or flush-mounted devices. Contact of the PC board is established by self-cleaning spring contacts directly on the contact pads of the PC board provided for this purpose, which can be coated in accordance with the requirements. To establish contact, it is sufficient to lock the terminal block into place in the lower part of the housing and to assemble the two housing parts.
The integrated contact system of the terminal block provides advantages in design compared to the usual pluggable spring clamp terminal blocks – they allow wall-mounted devices to be designed with lower height. Furthermore, through-holes and PC board drillings are not necessary – as a result, the opposite side of the PC board offers additional space for more electronic components. This allows the size of the PC board and thus the overall size of the device itself to be reduced further.
The push-in technique makes for easy connection. The spring contact adapts automatically to the conductor, which guarantees connection reliability and makes readjustment of the terminal block unnecessary (maintenance-free).
The spring clamp terminal block with compression-mount contacts is available in a grid spacing of 5.00 mm as pluggable and solderable version with a 90° connection direction in various pole numbers. They are thus suitable for wire-to-board and board-to-board applications.